课外研学讲座——The reliability challenge for advanced technologies: A critical concern for research, production, economy and modern society

发布者:孙威发布时间:2018-10-12浏览次数:13

讲座名称:The reliability challenge for advanced technologies: A critical concern for research, production, economy and modern society

主讲人:Yves Danto

主讲人简介:Yves DANTO received the Ph.D degree in electronics from the University of Bordeaux, France, in 1967. He joined IMS Lab (Integration; Materials and Systems) in 1981, where he was in charge to develop a new team in device failure analysis. Appointed full professor in 1982, he managed the reliability research group of IMS, was head of the Electronics Teaching Department of the University of Bordeaux., and member of the National University Council. He concentrated his research on developping new concepts on reliability physics, as well as technological and design solutions to answer the very high reliability challenge that has to face industry in the last years. He published around 200 research papers in International journals and conferences, and about 30 teaching papers in international conferences. He is currently Emeritus retired Professor.

List of areas of expertise relating to device reliability: Reliability physics accelerated testing, failure mechanisms, failure analysis, devices and IC technologies, reliability prediction.

 

请特别注意,由于是同一主题的系列讲座,先导讲座必须聆听,否则难以理解后续讲座内容。单独聆听先导讲座不可作为课外研学讲座。聆听先导讲座及其后续任意一场,可作为一场课外研学讲座。除先导讲座外,每场讲座可单独撰写报告,作为课外研学讲座考核要求。

报告内容:

先导讲座(必听):Basics of reliability

- The Reliability challenge

- Basics definitions; statistical approach

- Mean life time and Failure distributions

时间:101518:30-20:55;地点:九龙湖校区J1-105

 

系列讲座第一场(选听): Reliability assessment and life time prediction (3x45min)

- stress environment and aging modelling

- Test by “aging acceleration”

- Lifetime prediction

- Industrial strategies

时间:101718:30-20:55;地点:九龙湖校区J1-105

 

系列讲座第二场(选听):Packaging and assemblies reliability

-Evolution of electronic assemblies technologies

-Main cause of aging and failure

-Techniques for failure analysis

-Assemblies design for reliability

时间:101818:30-20:55;地点:九龙湖校区J1-105

 

系列讲座第三场(选听):Reliability of complex systems

-Mission profiles of systems and specifications of use

-Impact of complexity on failure probability

-Redundancy and its limitations

-The new approach of reliability monitoring

时间:101918:30-20:55;地点:九龙湖校区J1-105

 

系列讲座第四场(选听):Reliability of high integrated semiconductor circuits

-Impact of down scaling on semiconductor IC

-Overview of DSM (Deep Sub Micronics) technologies

-Electromigration, Time Dependant Dielectric Breakdown ,

-High Current injection, Negative Bias -temperature Instability

时间:102018:30-20:55;地点:九龙湖校区J1-105

教务处实践教学科

课外研学讲座活动指导中心

20181012

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