时间：2024年12月13日，周五
16:00-17:30
地点：无线谷1319会议室
题目：3D Intelligent Metasurfaces and Their Applications
主讲人：Chau Yuen, Associate Professor
报告摘要：In this talk, we will introduce two innovative types of 3D intelligent metasurfaces: Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM). We will explore their exciting applications in wireless communication and sensing systems. Specifically, SIM is a groundbreaking computing architecture that enables joint signal processing and communication in the electromagnetic (EM) domain. A SIM is fabricated by stacking an array of programmable metasurface layers, where each layer consists of many low-cost passive meta-atoms that can individually manipulate EM waves. By appropriately configuring the passive meta-atoms, a SIM can automatically accomplish advanced computation tasks as the EM wave propagates through it while reducing both energy consumption and processing delay. By contrast, an FIM takes a different approach to leverage the 3D physical space. An FIM is composed of an array of low-cost radiating elements, each of which can independently radiate electromagnetic signals while flexibly adjusting its position along the direction perpendicular to the surface. Hence, unlike conventional rigid 2D antenna arrays, the FIM surface shape may be dynamically reconfigured to improve the channel quality by beneficial 3D morphing.
报告人简介：Chau Yuen received the B.Eng. and Ph.D. degrees from Nanyang Technological University, Singapore, in 2000 and 2004, respectively. He was a Post-Doctoral Fellow with Lucent Technologies Bell Labs, Murray Hill, in 2005. From 2006 to 2010, he was with the Institute for Infocomm Research, Singapore. Since 2023, he has been with the School of Electrical and Electronic Engineering, Nanyang Technological University. Dr. Yuen received IEEE Communications Society Leonard G. Abraham Prize (2024), IEEE Communications Society Best Tutorial Paper Award (2024), IEEE Communications Society Fred W. Ellersick Prize (2023), IEEE Marconi Prize Paper Award in Wireless Communications (2021), IEEE APB Outstanding Paper Award (2023), and EURASIP Best Paper Award for JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING (2021). He is an IEEE Fellow and also a Highly Cited Researcher by Clarivate Web of Science.
